Semiconductor devices - Time-dependent dielectric breakdown (TDDB) test for inter-metal layers1 Scope This part of IEC 62374 describes a test method, test structure and lifetime estimation method of the time dependent dielectric breakdown (TDDB) test for inter metal layers applied in semiconductor devices.

multiple wires

BS EN 4057-401 contains details on the test procedure and testing requirement

This Published Document is not applicable to the offshore industry or to the mining industry

a) surface condensation

Procurement

NOTE 2: This document does not apply to microbiological test systems for processes that rely on physical removal of microorganisms

Annex D (informative) Equivalent requirements in this part of ISO 8729 and IMO Resolution MSC

• Part 1: Guide to project management

and is suitable for all types of organizations

This standard specifies minimum requirements and does not prevent more complex solutions

8 Marking and other information

whenever feasible